Design Facilities

ASSEMBLY EXAMPLES

DESIGN

JUNCTION

ACTIVE AREA
(mm2)

CHIP DIMENSIONS
(mm2)

JUNCTION WINDOW

OHMIC WINDOW

WAFER
SIZE
(inch)

PACKAGE

ELEMENTS

PITCH
(µm)

Implant

Metal

Implant

Metal

ZZZ

20

1000

7.00 x 19.90

11.00 x 24.00

2

M

2

M

4

Standard FR4

EE2

40

500

20.00 x 50.00

2

M

2

M

4

Standard FR4

EE1

96

650

20 .00 x 62.40

2

M

2

M

4

Standard FR4

BB9

4

7000

27.90 x 94.80

30.00 x 96.88

2

M

2

M

6

Standard FR4

BB10

8

4944

39.45 x 74.15

43.30 x 78.00

2

M

2

M

4

Standard FR4

BB16

4

11600

46.30 x 70.40
Trapezoid Left & Right

50.40 x 75.56
Trapezoid Left & Right

2

M

2

M

4

Standard FR4

BB19

64

1200

50.00 x 76.77

53.50 x 80.32

2/7/9

P

2

M

4

Ceramic